Central Processing Unit Essay

Chapter 1

Introduction

1.1 Background

Modernisation has brought the advancement of central processing unit (CPU) to a higher stage compared to the last few decades. Basically a central processing unit (CPU) is an electronic chip in a computer that carries out the instruction of a computer program by performing the basic arithmetic, logical, control and input/output operation specified by the instructions. The design, form and application of central processing unit (CPU) have changed over the course of history, but their fundamental operation remains unchanged.

Nowadays most modern central processing unit (CPU) is called microprocessors, which mean that they are contained in a single integrated circuit. Over the course of history the

Therefore the central processing unit (CPU) need requires more heat dissipation in the form of CPU cooling solution. Normally the optimum operating temperature of a central processing unit (CPU) is at room temperature, or ideally as cool as possible. A hot central processing unit (CPU) would cause problems ranging from system crashes and physical damages due to overheat. Common CPU failure mechanisms tend to be mechanical (wire bond failure, die fracture, corrosion) and electrical (overstress, migration and diffusion, gate oxide breakdown) Following the Arrhenius equation, (for die temperatures operating in the range of -20ºC to 140ºC) every 10ºC decrease in temperature reduces the failure rate by approximately a factor of 2. We can therefore expect a reduction in chip failure rates with lower operating temperatures (M.

Critical application of central processing unit (CPU) in servers or a high performance computer requires an advanced cooler mechanism that would bring the temperature down to an optimum level. Thus, thermoelectric cooler (TEC) would be needed to assist the cooling down of the central processing unit (CPU). However, there are many problems plaguing thermoelectric cooler. They are notoriously known for their high power consumption, low coefficient of performance (C.O.P) and limitation due to inefficient system used. Thus in this project it would be covering the optimisation of the thermoelectric cooler (TEC) cooling module for active central processing unit (CPU) cooling.

1.3 Objective of the Project

There are four objectives that need to be achieved in this project, and they are:

i. To overcome heating problem caused by the central processing unit (CPU). ii. To design and develop an optimized thermoelectric cooler (TEC) cooling module for active central processing unit (CPU) cooling. iii. To determine the optimal design for the thermoelectric cooler (TEC) cooling