Flat Evaporator Case Study

Experimental Optimization of LHP with Flat Plate Evaporator

Scientific background
All electronic devices and circuits generate excess heat and if the operating temperature exceeds the certain limit it greatly effects the performance of the device and consumer safety, thus require thermal management to improve reliability and prevent premature failure. With the continuous increase in functionality and performance of electronics chips, along with the advancement in technology for large-scale integration of electronic circuits into compact form, the demand for greater heat dissipation in a more constricted space has grown tremendously. However, the traditional approach may not be feasible for some newer electronic devices because of cost, size, power consumption, reliability, weight,

LHPs with flat evaporators are currently receiving a lot of attentions because they providing more space to spread heat from concentrated heat source. Although flat evaporator LHPs are already used in many electronic equipment but there are still improvements needed to increase the application range. So, LHP with a flat evaporator will be fabricated to investigate its heat transfer characteristics under different operating conditions.

Purpose and Objective of the Study
The primary objective of the research will be energy efficient thermal management of electronic devices using flat evaporator LHPs. Thermal management of electronic components has today become a major consideration in the design of electronic products. Efficient cooling of electronic devices improves sustainability leading to enhance reliability and life expectancy of components.

Methodology and Research Plan
The methodology and research plan that the proposed study will follow is given