Heat Conduction Process

In a metal solid (standard copper cylinder), the heat conduction process will only happen when there is vibrational motion of the molecule. The molecule inside the copper metal is found in lattice structure. So, when heat energy is supplied on it, the molecules will gain kinetic energy and hence begin to vibrate.The molecules which are in fast-moving of the warmer part of copper metal will collide with the slower moving molecules of the cooler region. Once the collision is happened, the cooler molecule will gain some heat energy and so later collide with other molecules in cooler region. This collision process will continue until the heat energy from warmer region is spread through the cooler region. From here, we can notice that the heat is

Thus, it is a need to minimise this to happen by ensure the side of the standard cylinder is well insulated with insulating material like sponge. Because of the insulation, the heat conduction process is then happen in one dimensional. Therefore,the heat energy is flowing in one direction and hence give an easy way for us to measure the thermal conductivity of SUS 304. Based on Fourier’s Law of conduction, the process should be under steady state condition which mean there is no change in heat transfer rate, Q between the two test pieces, independent of time. This can be proved by comparing the Q value of the two test piece. For instance, both test pieces show same value of Q with 14720 kcal/m^2 h⁰Cwhen the temperature is setted to 100⁰C and flow rate of water at 100 Litre/Hour. The water flow is maintained in a constant rate throughout the

This can be explained through the result of the experiment. When the temperature is setted to 100 ºC, the K value of the specimen is 3.925kcal/(mh⁰C) .However, the K value of the specimen turn to a higher value at 9.174 kcal/(mh⁰C) once the set temperature is 200 ºC. Obviously, the K value is directly proportional to the temperature . Meanwhile, the different thickness of the SUS 304 also show an effect on the K value. The K value increases when the thickness of specimen decreases. For example, at constant temperature100 ºC and flow rate 100L/ Hour, the thicker test piece (4.0mm) show the lower K value ( 5.888kcal/(mh⁰C)) whereas 11.776 kcal/(mh⁰C) for the thinner test piece (2.0mm). The difference in K value between the two test pieces may be because of the presence of the resistance. This can be explained when the resistance is reciprocal of conduction. In addition, the main purpose for the two test pieces to have different thickness is to eliminate the contact resistance. The presence of contact resistance will cause the temperature