Microchannels Lab Report

Abstract—The overall performance of MCHS as a system is effected by the inlet and outlet manifold arrangements in addition to array of microcannels. In the present work the experimental analysis is performed and compare the heat transfer coefficient, Nusselt number and pressure drop for three different manifold arrangements are made. In the experiment deionized water is made to flow through the inlet manifolds to the array of microchannels and exit is through outlet manifolds. In the present work three different arrangements: R, RSC and DC of the inlet and outlet manifolds are selected. The result shows the experimentally analysis of MCHS with DC type manifold flow arrangement have average 30% more heat transfer coefficient than R type and

INTRODUCTION

Micro channels are widely used in various engineering applications to enhance the convective heat transfer. In 1981 Tuckerman and Pease [1] introduce the concept of microchannel heat sink. They compared microchannel heat sink with conventional heat exchanger microchannels. They concluded that microchannel heat sink have a low to moderate pressure drop, less amount of coolant due to smaller geometric size of channels and lower operational cost with higher heat transfer performance. Hassan et al. [2] studied the use of microchannels in computer and electronic devices for cooling purpose. Weilin Qu et al. [3] have investigated both experimentally and numerically the pressure drop and heat transfer characteristics for a single phase micro-channels by selecting Reynolds number in the range of 139 to 1672 for different values of heat flux. It has been concluded that higher Reynolds number reduces the water outlet temperature and temperature within heat sink has also reason for greater pressure drop. Wang and Peng[4] have been carried out an experiment on single phase forced flow convection with water/methanol as a working fluid with a 790 w/cm2

While fig 1 shows the schematic diagram of experimental setup fig 2 shows the microchannels heat sink. Fig 3 (a,b,c) shows the computational model of different types of manifold (R,RSC,DC) and Fig 4 shows Microchannel heat sink with adapter. Material is used for microchannel is copper while material of cover with manifold is of acrylic sheet. P type flow arrangement has been used in this experiment. In P-type flow arrangement, the fluid firstly filled the inlet plenum from the starting point and after its fills the whole plenum. Due to that it enhance the fluid contact effect. The specification of the Microchannel heat sink and acrylic cover is given in table