Ohmic Essay

A STUDY ON THE CONTACT TECHNOLOGY OF NANOMATERIAL AND CHARACTERIZATION OF THE OHMIC CONTACT IN CdS-Al JUNCTION

Sambeet Mishra

Department of Electrical Power Engineering,

Tallinn University of Technology

Tallinn, Estonia

Email id – [e-mail] Prof B. Ghosh

Leverhulme Visiting Professor, Newcastle University, UK Dr C. K. Panigrahi

School of Electrical Engineering,

KIIT University,

Bhubaneswar, India

Abstract – Incorporating the understanding of contact technology, its related problems and the possible solutions is utmost necessary in this era in order to achieve results which will ultimately show better device performance. The contact layer electrically couples metal layer with semiconductor layer and forms a semiconducting contact having low specific contact resistance. The fact that ohmic contact plays a major role in the performances of the devices cannot be overlooked; and owing to good ohmic contacts the efficiency and cost-effectiveness of devices gets improved. There are a lot of possible uses of the ohmic contacts in a variety of devices; one such is in the solar cells. Like ohmic contact, another thing that needs attention is the deposition method. A

Figure 11 shows the difference of total weight between before and after depletion. In figure 10, graphical representation of the overall summary of the depletions taken place were plotted for an understanding where, 1 shows NiP deposition over single cut copper strip, 2 is the NiP deposition over double cut copper strip and 3 is the overall deposition.

CHEMICAL REACTIONS

Electroless plating reaction is accomplished when hydrogen is released by a reducing agent, normally sodium hypophosphite (the hydrogen leaves as a hydride ion), and oxidized, thus producing a negative charge on the surface of the