Sputtering Method Essay

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3.1 Methodology

Cu2O was used as the main material in this research. After the decision was made, the process of fabrication and analysis method was planned. Sample preparation process was made using sputtering method. The samples were characterized using X-ray diffraction (XRD), Uv-Vis Spectrophotometer and profilometer.

3.2 Materials and Instruments

The instruments used in this experiment are shown in Table 3.1.

Table 3.1 Materials and Instruments used.
Materials Instruments
Glass Ultrasonicate
X-ray diffraction (XRD)
UV-Vis Spectrophotometer

3.3 Flowchart Sample Preparation and Characterization Technique

Figure 3.1 Flowchart of sample preparation.

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Only time duration were changed from 10 minutes, 20 minutes, 30 minutes, 40 minutes and 50 minutes in order to see the effect of time duration towards the growth rate the films. Five samples of films were made and every films have different time of deposition. Photo 3.2 shows the sputtering instruments used that are located at Material Science Laboratory, SST. Photo 3.2 Sputtering Instrument.

3.5 Characterization Technique

Sample has been done using sputtering technique. Thus the sample need to be analyzed as shown in Figure 3.2. The structure of the sample was examined by X-ray diffraction spectroscopy (XRD) while optical band gap by the UV-vis Spectrophotometer. The thickness and growth rate were examined by using profilometer.

3.5.1 Profilometer

Profilometer is instrument used for measure the thickness and Three Dimenson (3D) surface roughness on the thin films. Photo 3.3 shows profilometer instrument used at Sekolah Kejuruteraan Teknologi Maklumat (SKTM). It was mounted on a solid granite support plate with an active vibration damping system to prevent any vibration during the instrument is

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