Welding Lab Report

1777 Words8 Pages
Abstract-A study of electrical properties of two dissimilar metals joint was analyzed by different welding conditions. The joining of copper to aluminum is inevitable for certain applications in the electrical industry due to good conductivity and response offered by copper and aluminum for weight reduction. While in the majority of cases, dissimilar metals can be joined by friction welding, friction stir welding, bolted joint, fusion welding, solid-phase welding etc. In this metal joining reduces the loss in the bolded joining which are corrosion, flickers, discharges etc. The electrical conductivity study also carried out in different metal welded joints. Index Terms: Friction welding, electrical conductivity, aluminum, copper. I. INTRODUCTION…show more content…
While carrying out Friction stir welding on two dissimilar metals the conductivity increases and corrosion reduces. However in stir welding the metal can’t be welded again [1]. Even though Aluminum is heated to 359°C and copper was done at 560°C but these two dissimilar metals give very good welding strength. The weld pieces are subjected to compression test and it is proved the welding strength is good. The metals are welded at an r.p.m of at 1500 [2]. Because of friction stir welding the conductivity was improved RF generator and Auger electron spectroscopy (AES) The joints are subjected to vacuum cleaning. The discharge cleaning of the Cu/Ag is analyzed through RF generator. Discharge cleaning method is used in electronic industry. Discharge cleaning experiment was carried out using the vacuum system. The system contains two stage rotary pump with the pumping speed of 4.41/s. Any impurities in the metal were analyzed by (AES) Auger electron spectroscopy. The ohm meter was measure the electrical resistance of joints in that the conductivity has an increase in the metal joint[4]. In this method, the electrical conductivity increases through discharge cleaning. Eddy current and ACPD…show more content…
EDS analysis of the Al/Cu interface and XRD pattern with the annealing condition of 773K and 129.6 ks [6]. The optical microstructure of EMPA line analysis of the friction welded Al/Cu interface under optimum condition P1=100MPa, P2=100MPa, t1=0.1s, t2=5s and 200 r.p.m of rotation speed was analyzed. Friction welding minimizes the intermetalic compound in the dissimilar metal. Fig 3 shows the SEM images of different annealing condition. Time and temperature increased intermetalic formed also increased. The XRD pattern and EDS analysis which tells two intermetalic compounds are formed during annealing. XRD pattern conform two intermetalic compounds are Al Cu, Al2Cu. Fig 4. Relationship between thickness of intermetallic and annealing conditions: (a) annealing temperature [6] Fig.4 shows the relationship between thicknesses of intermetalic and annealing condition. The temperature increases intermetalic thickness also increases. The intermetalic layer thickness with various times and temperature was analyzed. Annealing time increases intermetalic thickness also increases [6]. Fig 5. The Pulsed Eddy Current responses to the crack depending on the

More about Welding Lab Report

Open Document