Semiconductor Electronics Case Study

The manufacturing of semiconductor products consists of four stages: wafer fabrication, wafer sort and test, packaging and assembly, and functional (electrical) tests. These four stages can be divided into two categories. Wafer fabrication and wafer sort & test are referred to as front-end manufacturing operations. Packaging, assembly, and functional testing are referred to as backend manufacturing operations.

Burn – In:
Burn-In is the application of thermal and electrical stress for the purposes of inducing the failure of marginal devices, those with inherent defects or defects arising from manufacturing aberrations which cause time and stress dependent failures. [1] It is a part of production flow in the backend test sequence, which exposes

Each device that comes out of the foundry is prone to get affected by static charge, this is a very big and serious problem in microelectronics industry, the test engineers take very extensive care to not affect the devices with any static charge, but the real concern starts during the design stages, when the designer draws the layout, a strenuous effort is taken to enclose the PMOS and N-MOS, in separate guard-rings and connect each one to the potential source nearest to it. But this is not sufficient, when the design goes to the foundry to get etched into silicon there is a whole lot more precaution to be taken care so that the of doping of ions do not affect. Moreover, during packaging there exists the last portion of

The discharge waveform is intended to approximate the ESD event from a human fingertip to a pin of the component. The test actually discharge +/- 3zaps for each pin combination. The unit begin tested should remain functional for all the samples at a particular discharge level to pass the HBM test. If the test fails, single polarity zaps is performed to isolate the failing ESD device.
Charged Device Model: In the previous topic the discussion was on the involvement of humans in affecting the performance of an IC due to ESD, here the focus will be on the other devices which might affect the IC electrostatically. In CDM, charges are accumulated on DUT and it discharges to another contacted object which is at lower potential.
For example, charges are accumulated on the DUT when it slides through the shuttle during test. These charges may get collected on the lead frame or package and discharge through a pin that subsequently is grounded, causing damage to the